Application Mask for printed circuit boards during solder dip process. Features Adhesion to Steel: 6N/25mm (Test method GB2792-98) Tensile Strength at Break: 42N/cm (Test method GB-T7753-87) Elongation at Break: >100% (Test method GB-T7753-87) Storage Details Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging. Shelf life is 6 …