Application
Mask for printed circuit boards during solder dip process.
Features
Adhesion to Steel: 6N/25mm (Test method GB2792-98)
Tensile Strength at Break: 42N/cm (Test method GB-T7753-87)
Elongation at Break: >100% (Test method GB-T7753-87)
Storage Details
Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging. Shelf life is 6 months for green masking tape
